Backplane is also a Printed Circuit Board, which is usually stacked up between 8 to 28 layers with FR4 materials. A Backplane works as the role of system carrier onto which a couple of daughter boards or line cards are mounted through connecting with the slots on its surface.
The primary function of a Backplane PCB is to carry and distribute power supplies and signals etc. to each daughter board in order that electrical connections and signal transmissions among different units can be achieved.
As a result, a backplane is able to realize all the functions of the whole system through the joint efforts with its carried daughter boards / line cards / connectors etc.
Special Characteristics of Backplane PCBs
Due to its more special function, a Backplane has some typical different features when compared with other types of PCBs.
A Backplane usually carries with some other boards and components on it and it’s also connected with other external boards or devices, so it requires larger size than common PCBs.
Higher Layer Count
A Backplane has 8 layers at least, most of them have 16-28 layers.
In order to withstand more mechanical stress, a Backplane PCB has to be designed thicker. Its thickness can be 2mm-6mm or even thicker.
With its larger and thicker characteristics, a Backplane PCB will be definitely heavier than common PCBs.
More Drilling Hole Counts
To realize more electrical connections and signal transmissions, a large number of blind and / or buried holes will be designed to ensure the complex structure and function achievement.
Higher Heat Capacity
The more copper layers and via holes of a Backplane enables higher heat capacity, which will guarantee more efficient power distribution and higher speed of signals transmission.
Applications of Backplane PCBs
– Communication Equipment
– Large Servers
– Medical Electronics
– Military Applications
– Aviation & Aerospace
The enhanced performance on power distribution and signal transmission relies on more complex structures and interconnections of a Backplane. Therefore, more challenges need to be conquered during the Backplane PCB manufacturing process including: board thickness and dimensions, higher board layers, more strict alignment control, back drilling depth control, electroplating capability, via holes cleaning, impedance control and EMC (Electro Magnetic Compatibility) etc.
Please contact with our professional engineers with regards to any Backplane questions, X-Parts will tailor the most suitable solution for you under the comprehensive evaluations on function, manufacturability, quality and cost etc.